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Model to mount TP Link TL-SG608E on Multiboard. 0.2 layer. 15% infill. Supports for DC power hole.
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0 Likes5 DownloadsSeptember 3, 2024
10 Likes5 DownloadsSeptember 3, 2024
This model is restricted by licensing terms.
View license.
Instructions
Filament • 0.2mm
MaterialPLA
Layer height0.2 mm
Infill density15 %
SupportsGrid